EP3CLS70F484C8N vs EP3CLS200F484C8N Vergleich

Detaillierter Direktvergleich von EP3CLS70F484C8N von Intel und EP3CLS200F484C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3CLS70F484C8N EP3CLS200F484C8N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $56,80 $1.245,00
Family Cyclone III LS Cyclone® III LS
Device Logic Elements (LEs) 70,208 —
Logic Array Blocks (LABs) 4,388 [DATA_NEEDED: exact LAB count]
Embedded Memory Bits 3,068,928 bits (approx. 2,997 Kbit) —
DSP Blocks (18x18 Multipliers) 247 —
Maximum User I/Os 278 —
Phase-Locked Loops (PLLs) 4 —
Global Clock Networks 20 20
Core Supply Voltage 1.2 V —
Process Technology 65 nm TSMC low-power 65 nm CMOS, low-leakage
Gehäuse 484-ball FBGA (FineLine BGA), 23x23 mm 484-ball FBGA (FineLine BGA), 23 x 23 mm
Betriebstemperatur Commercial 0C to +85C (C8 grade) —
Speed Grade 8 (slowest commercial) 8 (slowest)
Configuration Modes Passive Serial (PS), Fast Passive Parallel (FPP), JTAG —
Bitstream Encryption AES-256 (LS family feature) AES-128 (256-bit key via separate license)
RoHS-Status Compliant Compliant
Series — Cyclone III LS
Logic Elements — 198,464
Embedded Memory — 8,211,456 bits (8.21 Mbit)
Embedded Multipliers (18x18) — 396
User I/O Pins — 210
Number of PLLs — 4
Core Voltage — 1.2 V
Maximum Operating Frequency — 402 MHz (fabric)
Temperature Grade — Commercial (0C to +85C TJ)
Configuration Mode — Active Serial (AS), Active Parallel (AP), Passive Serial (PS), JTAG
Montageart — Surface Mount (BGA)

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