EP3CLS70F780C7 vs EP3CLS100F780C7 Vergleich
Detaillierter Direktvergleich von EP3CLS70F780C7 von Intel und EP3CLS100F780C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3CLS70F780C7 | EP3CLS100F780C7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $350,00 | $632,40 |
| Family | Cyclone III LS | Cyclone III LS |
| Logic Elements | 70,208 | — |
| Embedded Memory Bits | 3,068,928 | — |
| User I/O Pins | 413 | — |
| Total I/O Pins | 780 (FBGA package) | — |
| Process Technology | 65 nm | 60 nm low-power CMOS |
| Core Supply Voltage (VCCINT) | 1.2 V | 1.2 V |
| Operating Frequency (max) | 437.5 MHz | — |
| Gehäuse | 780-ball FBGA | 780-ball FineLine BGA (FBGA-780) |
| Montageart | Surface Mount | — |
| Speed Grade | C7 (commercial, low power) | 7 (C7) |
| Security Features | AES-256 bitstream encryption, JTAG protection, volatile key storage | — |
| Embedded Multipliers | 18 x 18 multipliers (DSP blocks) | — |
| PLLs | Yes (per PLL specification) | — |
| RoHS-Status | Compliant | Compliant (lead-free FBGA) |
| Logic Elements (LEs) | — | 100,448 |
| Total RAM Bits | — | 4,451,328 |
| Embedded Memory | — | M9K blocks (488 total, 4,451,328 bits) |
| Embedded 18x18 Multipliers | — | 66 |
| Maximum User I/O Pins | — | 413 |
| Logic Array Blocks (LABs) | — | [DATA_NEEDED: exact LAB count for EP3CLS100] |
| Package Dimensions | — | 29 mm x 29 mm |
| Ball Pitch | — | 1.0 mm |
| I/O Supply Voltage (VCCIO) | — | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) |
| Configuration Modes | — | Active Serial (AS), Passive Serial (PS), JTAG |
| Bitstream Encryption | — | AES-128 (Cyclone III LS security feature) |
| Betriebs-Sperrschichttemperatur | — | 0C to +85C (commercial, 'C' grade) |