EP3CLS70F780I7N vs EP3SE50F780I4LG Vergleich
Detaillierter Direktvergleich von EP3CLS70F780I7N von Intel und EP3SE50F780I4LG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3CLS70F780I7N - 70,208 Logic Elements FPGA | Intel | Embedded Systems
EP3CLS70F780I7N ✓ Aktiv
Spezifikationsvergleich
| Parameter | EP3CLS70F780I7N | EP3SE50F780I4LG |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $880,00 | $2.380,00 |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Series | Cyclone III LS | Stratix III E |
| Logic Elements | 70,208 | 47,500 |
| Embedded Memory | 3,068,928 bits | 5.49 Mbit |
| Maximum User I/O | 413 pins | — |
| Versorgungsspannung | 1.2 V | — |
| Temperature Grade | Industrial | — |
| Package Type | BGA | — |
| Package Pin Count | 780 balls | — |
| Package Shape | Square | — |
| Terminal Form | Ball | — |
| Configuration Technology | SRAM-based FPGA | — |
| Configuration Method | [DATA_NEEDED: configuration method] | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature] | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | unknown | — |
| REACH Status | unknown | — |
| AEC-Q100 Qualification | unknown | — |
| Family | — | Stratix III |
| Adaptive Logic Modules (ALMs) | — | 19,000 |
| Maximum User I/Os | — | 488 |
| Gehäuse | — | 780-ball FCBGA (FBGA-780) |
| Operating Supply Voltage (Core) | — | 1.1 V |
| Betriebstemperaturbereich | — | -40 C to +100 C |
| Process Node | — | 65 nm |
| DSP Blocks | — | Yes (dedicated, count not in source data) |
| High-Speed Transceivers | — | Multi-gigabit, count not in source data |
| Lead-Free / RoHS | — | Yes (G suffix = Pb-free) |
| Packaging | — | Tray |
| Speichertyp | — | Embedded SRAM block RAM |