EP3SE110F1152C4 vs EP3SE110F1152I4L Vergleich
Detaillierter Direktvergleich von EP3SE110F1152C4 von Intel und EP3SE110F1152I4L von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel
EP3SE110F1152C4 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP3SE110F1152C4 | EP3SE110F1152I4L |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2.200,00 | $4.317,90 |
| Family | Stratix III E | — |
| Logic Elements | 107,500 | 107,500 |
| Embedded Memory | 8,936,448 bits | — |
| Maximum User I/Os | 744 | — |
| DSP Blocks | [DATA_NEEDED: 18x18 multiplier count] | — |
| Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | — |
| Process Technology | 65 nm | 40 nm |
| Core Voltage | 1.1 V | — |
| Maximum Performance | 450 MHz | — |
| Package Type | 1152-ball FCBGA (Flip-Chip BGA) | — |
| Operating Temperature Grade | Commercial (C4) | — |
| Configuration Memory | SRAM-based (volatile) | — |
| On-chip Termination | Dynamic, programmable | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, HSTL, SSTL | — |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Series | — | Stratix III E |
| Embedded Memory Bits | — | 8,936,448 bits |
| User I/O Count | — | 744 |
| Number of LABs/CLBs | — | 4300 |
| DSP Multipliers | — | 528 (9-bit equivalent) |
| Gehäuse | — | 1152-BBGA, FCBGA |
| Montageart | — | Surface Mount |
| Betriebstemperatur | — | -40C to +100C (Industrial) |
| Speed Grade | — | I4 (fastest industrial grade) |
| Supply Voltage (Core) | — | [DATA_NEEDED: nominal core voltage] |
| MSL-Level | — | 3 (168 Hours) |
| Packaging | — | Tray |