EP3SE110F1152I2N vs EP3SE110F1152C4N Vergleich

Detaillierter Direktvergleich von EP3SE110F1152I2N von Intel und EP3SE110F1152C4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Intel
EP3SE110F1152C4N EP3SE110F1152C4N - Stratix III E FPGA, 107.5K LE, 1152-FCBGA | Intel

EP3SE110F1152C4N - Stratix III E FPGA, 107.5K LE, 1152-FCBGA | Intel

EP3SE110F1152C4N ⚠ Letzte Bestellmöglichkeit

Spezifikationsvergleich

Parameter EP3SE110F1152I2N EP3SE110F1152C4N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Letzte Kaufgelegenheit
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.480,00 $1.395,00
Series Stratix III Enhanced (EP3SE110) —
Family Stratix III Stratix III Enhanced (E)
Logic Elements (LE) 107,500 —
Logic Array Blocks (LABs) / CLBs 4,300 —
System Gates 8,936,448 —
User I/O Pins 744 744
Number of Terminals 1,152 —
Package Code BGA (FCBGA) —
Package Shape Square —
Ball Pitch 1.00 mm —
Supply Voltage Range 1.05 V to 1.15 V (nominal 1.1 V) —
Process Technology 40 nm low-power CMOS 65 nm
Maximum Internal Clock Frequency 100 MHz (per distributor summary; device supports multi-Gbps transceivers) —
Betriebstemperatur -40C to +100C (industrial) 0C to +85C (Commercial)
Speed Grade I2 —
Lead-Free / RoHS Yes (suffix N) —
Montageart Surface Mount Surface Mount
Logic Elements — 107,500
Memory Bits — 8,936,448
Embedded Multipliers (18x18) — 896
Logic Array Blocks (LABs) — 4300
Core Voltage — 1.1 V
Maximum Operating Frequency — 450 MHz
Gehäuse — 1152-ball FCBGA (Flip-Chip BGA)
Configuration Method — Passive Serial / Fast Passive Parallel / JTAG / AES-256
RoHS-Status — Compliant
MSL-Level — 3 (168 hours)
Design Software — Quartus II (v9.1 or later)

Datenblätter & Ressourcen

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