EP3SE110F780C4L vs EP3SE110F780C4N Vergleich
Detaillierter Direktvergleich von EP3SE110F780C4L von Intel und EP3SE110F780C4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE110F780C4L | EP3SE110F780C4N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.550,00 | $1.395,00 |
| Series | Stratix III E | Stratix III E |
| Number of Logic Elements (LE) | 107,500 | — |
| Number of Logic Array Blocks (LAB) | [DATA_NEEDED: number of LABs] | — |
| Total Memory Bits | 8,936,448 bits | — |
| Number of 18x18 Multipliers | 488 | — |
| Number of PLLs | [DATA_NEEDED: PLL count] | — |
| User I/O Pins | 488 | — |
| Speed Grade | -4 (commercial) | C4 |
| Process Variant | L (low-leakage) | — |
| Betriebstemperatur | 0C to +85C (commercial) | 0C to 85C (Commercial) |
| Supply Voltage (Core) | [DATA_NEEDED: core voltage] | — |
| Package Type | 780-Ball FCBGA | 780-BBGA, FCBGA |
| Ball Pitch | 1.0 mm | — |
| Montageart | Surface Mount | Surface Mount |
| Process Technology | 65 nm CMOS | — |
| RoHS-Status | Compliant | Compliant |
| MSL-Level | 3 (per JEDEC J-STD-020) | — |
| Family | — | Stratix III |
| Logic Elements (LEs) | — | 107500 |
| Embedded Memory Bits | — | 8936448 |
| User I/O Count | — | 488 |
| Number of Terminals | — | 780 |
| Package Code | — | BGA |
| Terminal Form | — | Ball |
| Package Shape | — | Square |
| Process Node | — | 65 nm |
| Configuration Mode | — | PS / FPP / JTAG |