EP3SE110F780C4L vs EP3SE80F780C4L Vergleich
Detaillierter Direktvergleich von EP3SE110F780C4L von Intel und EP3SE80F780C4L von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE110F780C4L | EP3SE80F780C4L |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.550,00 | $1.995,00 |
| Series | Stratix III E | — |
| Number of Logic Elements (LE) | 107,500 | — |
| Number of Logic Array Blocks (LAB) | [DATA_NEEDED: number of LABs] | — |
| Total Memory Bits | 8,936,448 bits | — |
| Number of 18x18 Multipliers | 488 | — |
| Number of PLLs | [DATA_NEEDED: PLL count] | — |
| User I/O Pins | 488 | — |
| Speed Grade | -4 (commercial) | C4 (commercial, speed grade 4) |
| Process Variant | L (low-leakage) | — |
| Betriebstemperatur | 0C to +85C (commercial) | 0C to +85C (Commercial) |
| Supply Voltage (Core) | [DATA_NEEDED: core voltage] | — |
| Package Type | 780-Ball FCBGA | — |
| Ball Pitch | 1.0 mm | — |
| Montageart | Surface Mount | Surface Mount |
| Process Technology | 65 nm CMOS | 65 nm |
| RoHS-Status | Compliant | Compliant (lead-free C4L suffix) |
| MSL-Level | 3 (per JEDEC J-STD-020) | — |
| Family | — | Stratix III E |
| Logic Elements | — | 80,000 |
| Logic Array Blocks (LABs) | — | 3200 |
| Embedded Memory (bits) | — | 6,843,392 |
| Maximum User I/O | — | 488 |
| Maximum Operating Frequency | — | 375 MHz |
| Transceiver Channels | — | 24 |
| Maximum Transceiver Data Rate | — | 8.34375 Gbps |
| PLLs | — | 4 |
| Core Voltage | — | 0.9 V |
| Gehäuse | — | 780-FCBGA (Fine-pitch Chip-Scale BGA, lead-free) |