EP3SE260F1152C2 vs EP3SE260F1152C2N Vergleich

Detaillierter Direktvergleich von EP3SE260F1152C2 von Intel und EP3SE260F1152C2N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SE260F1152C2 EP3SE260F1152C2N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $2.400,00 $11.000,00
Manufacturer Intel (formerly Altera) —
Series Stratix® III E Stratix III E
Logic Elements (LE) 255,000 —
Logic Array Blocks (LABs) 10,200 —
Embedded Memory (bits) 16,672,768 —
User I/Os 744 —
User I/O Banks [DATA_NEEDED: I/O bank count] —
Core Voltage (VCCINT) 1.1 V —
Process Technology 65 nm CMOS 65 nm
Gehäuse 1152-ball FC-FBGA (Flip Chip) —
Montageart Surface Mount Surface Mount
Speed Grade C2 (commercial) —
Betriebstemperatur Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits] [DATA_NEEDED: operating temperature grade]
RoHS-Status Compliant Compliant
Lead-Free Yes —
MSL-Level [DATA_NEEDED: MSL rating] [DATA_NEEDED: MSL rating]
Design Software Quartus II (Stratix III support) —
Family — FPGA - Field Programmable Gate Array
Number of Logic Elements — 255000
Number of LABs/CLBs — 10200
Total Memory Bits — 16672768
Number of I/O — 744
Voltage - Supply — 1.1 V
Gehäuse / Bauform — 1152-BBGA, FCBGA
Maximum Frequency — 600 MHz
Supplier Device Package — 1152-FCBGA
Lead Free — Yes (per EP3SE260F1152C2G comparison)
ECCN — [DATA_NEEDED: ECCN code]
Moisture Sensitivity — [DATA_NEEDED: MSL level]

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