EP3SE260F1152C3N vs EP3SE260F1152C2 Vergleich

Detaillierter Direktvergleich von EP3SE260F1152C3N von Intel und EP3SE260F1152C2 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SE260F1152C3N EP3SE260F1152C2
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $7.500,00 $2.400,00
Series Stratix III E Stratix® III E
Logic Elements / Cells 255,000 —
Embedded Memory Bits 16,672,768 bits —
Logic Array Blocks (LABs) 10,200 10,200
User I/O Count 744 —
Gehäuse 1152-BBGA, FCBGA 1152-ball FC-FBGA (Flip Chip)
Montageart Surface Mount Surface Mount
Process Technology 65 nm 65 nm CMOS
Core Voltage 1.1 V —
Betriebstemperatur 0 C to +85 C (Commercial) Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits]
Transceivers Integrated high-speed transceivers —
DSP Blocks Yes (dedicated multiplier/accumulator) —
Embedded Memory Type TriMatrix (true dual-port, FIFO, ROM, RAM) —
External Memory Support DDR3, DDR2, QDR II+, RLDRAM II —
Configuration Modes AS, AP, PS, FPP, JTAG —
Partial Reconfiguration Supported —
Programmable Power Technology Yes (up to 50% dynamic power reduction) —
RoHS-Status Compliant Compliant
Manufacturer — Intel (formerly Altera)
Logic Elements (LE) — 255,000
Embedded Memory (bits) — 16,672,768
User I/Os — 744
User I/O Banks — [DATA_NEEDED: I/O bank count]
Core Voltage (VCCINT) — 1.1 V
Speed Grade — C2 (commercial)
Lead-Free — Yes
MSL-Level — [DATA_NEEDED: MSL rating]
Design Software — Quartus II (Stratix III support)

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