EP3SE260F1152C3NES vs EP3SE260F1152C2 Vergleich

Detaillierter Direktvergleich von EP3SE260F1152C3NES von Altera und EP3SE260F1152C2 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Altera
EP3SE260F1152C3NES EP3SE260F1152C3NES - Stratix III E FPGA 255K LE 1152-FBGA | Altera

EP3SE260F1152C3NES - Stratix III E FPGA 255K LE 1152-FBGA | Altera

EP3SE260F1152C3NES ⚠ Letzte Bestellmöglichkeit

Spezifikationsvergleich

Parameter EP3SE260F1152C3NES EP3SE260F1152C2
Marke Altera Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Letzte Kaufgelegenheit Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $2.120,00 $2.400,00
Manufacturer Altera (now Intel FPGA) Intel (formerly Altera)
Series Stratix III E Stratix® III E
Family Stratix III Enhanced —
Logic Elements (LE) 255,000 255,000
Embedded Memory Bits 16,672,768 —
Logic Array Blocks (LABs) 10,200 10,200
Number of I/Os 744 —
Maximum Operating Frequency 500 MHz —
Process Technology 65 nm 65 nm CMOS
Core Supply Voltage 1.1 V —
Number of 18x18 Multipliers 768 —
Number of PLLs 12 —
Package Type 1152-ball FBGA (FineLine BGA) —
Pin/Package Designator F1152 —
Speed Grade -3 (faster) C2 (commercial)
Hard Memory Controllers 4 —
Hard PCIe Blocks 4 —
External Memory Interface DDR3, DDR2, DDR, QDRII+, RLDRAM2 —
Operating Temperature Grade Commercial —
Montageart Surface Mount Surface Mount
RoHS-Status Compliant Compliant
Lead-Free Yes Yes
Embedded Memory (bits) — 16,672,768
User I/Os — 744
User I/O Banks — [DATA_NEEDED: I/O bank count]
Core Voltage (VCCINT) — 1.1 V
Gehäuse — 1152-ball FC-FBGA (Flip Chip)
Betriebstemperatur — Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits]
MSL-Level — [DATA_NEEDED: MSL rating]
Design Software — Quartus II (Stratix III support)

Datenblätter & Ressourcen

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