EP3SE260F1152I3 vs EP3SE260F1152I3G Vergleich

Detaillierter Direktvergleich von EP3SE260F1152I3 von Intel und EP3SE260F1152I3G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SE260F1152I3 EP3SE260F1152I3G
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $16.500,00 $1.240,00
Series Stratix III E (EP3SE260) Stratix III E
Logic Elements 255,000 —
Number of LABs/CLBs 10,200 —
Total RAM Bits 16,672,768 —
User I/O Count 744 744
Number of Embedded Multipliers (DSP blocks) 768 —
Core Voltage 1.1 V —
Betriebstemperatur -40C to +100C (Industrial) —
Process Technology 65 nm 40 nm TSMC low-power
Maximum Fabric Frequency 500 MHz —
Gehäuse 1152-BBGA, FC-FBGA (Flip-Chip) 1152-BBGA, FCBGA (FineLine BGA)
Montageart Surface Mount Surface Mount (BGA)
Speed Grade I3 (Industrial, speed bin 3) I3 (Industrial, balanced)
MSL-Level [DATA_NEEDED: MSL level] —
RoHS-Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS compliance not stated in scraped data]
Product Status Obsolete (per Xecor comparator) —
Family — Stratix III
Logic Elements (LE) — 255,000
Embedded Memory Bits — 16,672,640 bits
Embedded Memory Bits (alternate) — 20,880 Kb (16,672,640 / 1024)
Betriebstemperaturbereich — -40C to +100C (Industrial)
Supply Voltage Core — 0.9 V (typical, see handbook)
Configuration Bitstream Encryption — AES-256 (Stratix III feature)
I/O Standards Supported — LVDS, LVPECL, HSTL, SSTL, LVCMOS, PCI, PCI-X
Feuchtigkeitsempfindlichkeitsgrad (MSL) — [DATA_NEEDED: MSL rating per JEDEC J-STD-020]
Lead-Free Reflow — [DATA_NEEDED: peak reflow temperature]
Design Toolchain — Quartus II / Quartus Prime
Country of Origin / Distribution — Multiple authorized distributors (DigiKey, Mouser)

Datenblätter & Ressourcen

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