EP3SE260F1152I3 vs EP3SE260F1152I4LN Vergleich
Detaillierter Direktvergleich von EP3SE260F1152I3 von Intel und EP3SE260F1152I4LN von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE260F1152I3 | EP3SE260F1152I4LN |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $16.500,00 | $3.520,00 |
| Series | Stratix III E (EP3SE260) | Stratix III |
| Logic Elements | 255,000 | — |
| Number of LABs/CLBs | 10,200 | — |
| Total RAM Bits | 16,672,768 | — |
| User I/O Count | 744 | — |
| Number of Embedded Multipliers (DSP blocks) | 768 | — |
| Core Voltage | 1.1 V | 0.9 V (supports 1.05-1.15 V variant) |
| Betriebstemperatur | -40C to +100C (Industrial) | -40 C to +100 C (Industrial) |
| Process Technology | 65 nm | — |
| Maximum Fabric Frequency | 500 MHz | — |
| Gehäuse | 1152-BBGA, FC-FBGA (Flip-Chip) | FCBGA-1152 (1517-ball) |
| Montageart | Surface Mount | Surface Mount |
| Speed Grade | I3 (Industrial, speed bin 3) | — |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant |
| Product Status | Obsolete (per Xecor comparator) | — |
| Family | — | Stratix III E |
| Process Node | — | 65 nm CMOS |
| Logic Elements (LE) | — | 255,000 |
| Logic Array Blocks (LAB) | — | 10,200 |
| Embedded Memory Bits | — | 16,672,640 |
| User I/Os | — | 744 |
| Package Dimensions | — | 35 x 35 mm |
| Operating Frequency | — | Up to 717 MHz |
| Supply Voltage Range | — | 0.9 V core, 1.05 V-1.15 V supported |
| Design Tool | — | Quartus II |