EP3SE260F1152I3G vs EP3SE260F1152I3 Vergleich

Detaillierter Direktvergleich von EP3SE260F1152I3G von Intel und EP3SE260F1152I3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SE260F1152I3G EP3SE260F1152I3
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.240,00 $16.500,00
Series Stratix III E Stratix III E (EP3SE260)
Family Stratix III —
Logic Elements (LE) 255,000 —
Embedded Memory Bits 16,672,640 bits —
Embedded Memory Bits (alternate) 20,880 Kb (16,672,640 / 1024) —
User I/O Count 744 744
Gehäuse 1152-BBGA, FCBGA (FineLine BGA) 1152-BBGA, FC-FBGA (Flip-Chip)
Betriebstemperaturbereich -40C to +100C (Industrial) —
Speed Grade I3 (Industrial, balanced) I3 (Industrial, speed bin 3)
Process Technology 40 nm TSMC low-power 65 nm
Supply Voltage Core 0.9 V (typical, see handbook) —
Configuration Bitstream Encryption AES-256 (Stratix III feature) —
I/O Standards Supported LVDS, LVPECL, HSTL, SSTL, LVCMOS, PCI, PCI-X —
Montageart Surface Mount (BGA) Surface Mount
RoHS-Status [DATA_NEEDED: RoHS compliance not stated in scraped data] [DATA_NEEDED: RoHS status]
Feuchtigkeitsempfindlichkeitsgrad (MSL) [DATA_NEEDED: MSL rating per JEDEC J-STD-020] —
Lead-Free Reflow [DATA_NEEDED: peak reflow temperature] —
Design Toolchain Quartus II / Quartus Prime —
Country of Origin / Distribution Multiple authorized distributors (DigiKey, Mouser) —
Logic Elements — 255,000
Number of LABs/CLBs — 10,200
Total RAM Bits — 16,672,768
Number of Embedded Multipliers (DSP blocks) — 768
Core Voltage — 1.1 V
Betriebstemperatur — -40C to +100C (Industrial)
Maximum Fabric Frequency — 500 MHz
MSL-Level — [DATA_NEEDED: MSL level]
Product Status — Obsolete (per Xecor comparator)

Datenblätter & Ressourcen

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