EP3SE260F1517C2G vs EP3SE260F1517I3G Vergleich
Detaillierter Direktvergleich von EP3SE260F1517C2G von Intel und EP3SE260F1517I3G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE260F1517C2G | EP3SE260F1517I3G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2.050,00 | $3.520,00 |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 254,400 | 255,000 |
| Adaptive Logic Modules (ALMs) | 81,760 | — |
| Total Memory Bits | 16,727,680 (16.67 Mbit) | — |
| Embedded Memory (M9K Blocks) | 864 | — |
| Embedded Multipliers (18x18) | 768 | — |
| User I/O Pins | 976 | — |
| Transceiver Channels | 12 | — |
| Transceiver Data Rate (max) | 3.75 Gbps (C2 grade) | — |
| PLLs (Fractional + Clock Multiplier) | 8 fractional + 4 CMU | — |
| Global Clock Networks | 20 | — |
| Gehäuse | 1517-ball FCBGA, 40x40 mm | 1517-ball FC-FBGA (Flip-Chip BGA) |
| Speed Grade | C2 (commercial, ~6 ns) | — |
| Betriebstemperatur | 0C to 85C (commercial, "C" suffix) | — |
| Process Node | 40 nm TSMC | 65 nm |
| RoHS-Status | Compliant | — |
| Lead-Free / Halogen-Free | Yes / Yes | — |
| Embedded Memory Bits | — | 16,672,768 |
| Maximum Operating Frequency | — | 500 MHz |
| Core Voltage | — | 1.1 V |
| User I/O Count | — | 976 |
| Montageart | — | Surface Mount |
| Embedded Multipliers | — | 768 (18x18) |
| PLL Count | — | 12 |
| Transceiver Data Rate | — | Up to 6.375 Gbps |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Lead-Free / RoHS | — | Yes (RoHS compliant per DigiKey listing) |
| MSL-Level | — | [DATA_NEEDED: MSL level] |