EP3SE260F1517C3 vs EP3SE260F1517I3 Vergleich
Detaillierter Direktvergleich von EP3SE260F1517C3 von Intel und EP3SE260F1517I3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE260F1517C3 | EP3SE260F1517I3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $10.800,00 | $10.500,00 |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix III E | — |
| Logic Elements | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| User I/Os | 976 | — |
| DSP Blocks (18x18 multipliers) | 768 | — |
| PLLs | 12 | — |
| Core Voltage | 0.9 V | 1.0 V typical |
| Process Node | 65 nm (TSMC) | — |
| Gehäuse | 1517-BBGA, FCBGA (FineLine BGA) | 1517-BBGA, FCBGA |
| Package Pitch | 1.0 mm | — |
| Operating Temperature Grade | Commercial (C suffix) | Industrial |
| Speed Grade | 3 | — |
| Configuration | SRAM-based, requires external configuration device | SRAM-based, volatile (requires external configuration device) |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| Family | — | Stratix III E |
| Embedded Memory (bits) | — | 16,672,768 |
| Maximum User I/Os | — | 976 |
| Junction Temperature Range | — | -40C to +125C |
| Process Technology | — | 65 nm CMOS |
| Maximum Core Frequency | — | 717 MHz |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, HSTL, SSTL |