EP3SE260F1517I3 vs EP3SE260F1517C4N Vergleich
Detaillierter Direktvergleich von EP3SE260F1517I3 von Intel und EP3SE260F1517C4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE260F1517I3 | EP3SE260F1517C4N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $10.500,00 | $7.800,00 |
| Family | Stratix III E | Field-Programmable Gate Array (FPGA) |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory (bits) | 16,672,768 | — |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Maximum User I/Os | 976 | 976 |
| Gehäuse | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA |
| Montageart | Surface Mount | Surface Mount |
| Operating Temperature Grade | Industrial | — |
| Junction Temperature Range | -40C to +125C | — |
| Core Voltage | 1.0 V typical | 0.9 V |
| Process Technology | 65 nm CMOS | — |
| Maximum Core Frequency | 717 MHz | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, HSTL, SSTL | — |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS status] |
| Configuration | SRAM-based, volatile (requires external configuration device) | — |
| Series | — | Stratix® III E |
| Embedded Memory | — | 16,672,768 bits |
| Betriebstemperatur | — | 0°C to 85°C |
| Process Node | — | 65 nm |
| MSL-Level | — | [DATA_NEEDED: MSL level] |
| Lead Free | — | [DATA_NEEDED: lead-free status] |
| Maximum Transceiver Data Rate | — | 12.5 Gbps |