EP3SE260F1517I3G vs EP3SE260F1517C2N Vergleich
Detaillierter Direktvergleich von EP3SE260F1517I3G von Intel und EP3SE260F1517C2N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SE260F1517C2N - Stratix III E FPGA 255K LE 1517-FCBGA | Intel
EP3SE260F1517C2N ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP3SE260F1517I3G | EP3SE260F1517C2N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3.520,00 | $4.750,00 |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory Bits | 16,672,768 | — |
| Maximum Operating Frequency | 500 MHz | — |
| Core Voltage | 1.1 V | 1.1 V |
| User I/O Count | 976 | — |
| Gehäuse | 1517-ball FC-FBGA (Flip-Chip BGA) | 1517-ball FC-BGA |
| Montageart | Surface Mount | Surface Mount |
| Process Node | 65 nm | — |
| Embedded Multipliers | 768 (18x18) | — |
| PLL Count | 12 | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) |
| Lead-Free / RoHS | Yes (RoHS compliant per DigiKey listing) | — |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| Logic Array Blocks (LABs) | — | 10,200 |
| Total Memory Bits | — | 16,672,768 |
| Maximum User I/Os | — | 976 |
| Process Technology | — | 65 nm |
| Maximum Core Frequency | — | 600 MHz |
| Configuration Interface | — | Passive Serial, Fast Passive Parallel, JTAG, Active Serial |
| Lead Free | — | Yes |
| RoHS-Status | — | Compliant |
| Speed Grade | — | C2 |