EP3SE260F1517I4LN vs EP3SE260F1517I3 Vergleich

Detaillierter Direktvergleich von EP3SE260F1517I4LN von Intel und EP3SE260F1517I3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Intel
EP3SE260F1517I4LN EP3SE260F1517I4LN - 260K LE Stratix III E FPGA, 1517-FCBGA | Intel

EP3SE260F1517I4LN - 260K LE Stratix III E FPGA, 1517-FCBGA | Intel

EP3SE260F1517I4LN ⚠ Letzte Bestellmöglichkeit

Spezifikationsvergleich

Parameter EP3SE260F1517I4LN EP3SE260F1517I3
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Letzte Kaufgelegenheit Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $2.895,00 $10.500,00
Logic Elements 255,000 255,000
Embedded Memory Bits 16,672,768 bits (~2,044 KBytes) —
Logic Array Blocks (LABs) 10,200 10,200
User I/O Count 976 —
Gehäuse 1517-ball FCBGA (40 mm x 40 mm, 1.0 mm pitch) 1517-BBGA, FCBGA
Process Technology 40 nm CMOS 65 nm CMOS
Family Stratix III E (Enhanced) Stratix III E
Speed Grade I4 (industrial, 4th tier) —
Power Option L (low-power) —
Betriebstemperatur -40C to +100C (case, industrial) —
Lead-Free / RoHS Yes (N suffix) —
Transceivers Stratix III E family supports up to 24 transceivers up to 8.5 Gbps —
DSP Blocks (18x18 multipliers) Up to 384 (family-level, device-specific count not in provided data) —
Partial Reconfiguration Supported —
Memory Interface Support DDR3, DDR2, QDR II+ (hardened PHY) —
Configuration Scheme Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG —
Embedded Memory (bits) — 16,672,768
Maximum User I/Os — 976
Montageart — Surface Mount
Operating Temperature Grade — Industrial
Junction Temperature Range — -40C to +125C
Core Voltage — 1.0 V typical
Maximum Core Frequency — 717 MHz
I/O Standards Supported — LVDS, LVTTL, LVCMOS, HSTL, SSTL
RoHS-Status — Compliant
Configuration — SRAM-based, volatile (requires external configuration device)

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