EP3SE260H780C3 vs EP3SE260H780C2 Vergleich
Detaillierter Direktvergleich von EP3SE260H780C3 von Intel und EP3SE260H780C2 von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Altera
EP3SE260H780C2 - Stratix III E 260K LE FPGA | Altera | 780-BGA
EP3SE260H780C2 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP3SE260H780C3 | EP3SE260H780C2 |
|---|---|---|
| Marke | Intel | Altera |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.180,00 | $2.150,00 |
| Device Family | Stratix III Enhanced (Stratix III E) | — |
| Series | EP3SE | Stratix III |
| Logic Elements | 255,000 | — |
| Logic Array Blocks (LABs) | 10200 | — |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| User I/Os | 488 | 488 |
| Operating Voltage (Core) | 0.9 V | — |
| Operating Voltage (Auxiliary) | 1.1 V | — |
| Process Technology | 65 nm CMOS | — |
| Speed Grade | C3 | — |
| Betriebstemperatur | Commercial, 0C to +85C | 0C to +85C (Commercial) |
| Maximum Core Frequency | 500 MHz | — |
| Gehäuse | 780-ball FCBGA (HBGA), flip-chip | 780-BBGA, FCBGA |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Feuchtigkeitsempfindlichkeitsgrad (MSL) | 3 (168 hours) | — |
| Packaging Type | Tray | — |
| Configuration Memory Support | Fast passive parallel, JTAG, Active Serial | — |
| RoHS-Status | Compliant (per product listings) | Compliant |
| Family | — | Stratix® III E |
| Logic Elements (LE) | — | 255,000 |
| Adaptive Logic Modules (ALM) | — | 102,000 |
| Embedded Memory (bits) | — | 16,672,768 |
| Number of LABs/CLBs | — | 10,200 |
| Process Node | — | 65 nm |
| Core Voltage | — | 0.86 V to 1.15 V |
| Lead Free | — | Yes |
| MSL-Level | — | 3 (per JEDEC J-STD-020) |