EP3SE260H780C3N vs EP3SE260H780C3 Vergleich

Detaillierter Direktvergleich von EP3SE260H780C3N von Intel und EP3SE260H780C3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SE260H780C3N EP3SE260H780C3
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.325,00 $1.180,00
Series Stratix® III E EP3SE
Logic Elements (LE) 255,000 —
Embedded Memory (bits) 16,672,768 —
Number of LABs/CLBs 10,200 —
User I/Os 488 488
Number of Pins / Balls 780 —
Gehäuse 780-BBGA, FCBGA (H780) 780-ball FCBGA (HBGA), flip-chip
Montageart Surface Mount Surface Mount (BGA)
Betriebstemperatur 0 °C to +85 °C (C grade, commercial) Commercial, 0C to +85C
Process Technology 40 nm CMOS 65 nm CMOS
Maximum Core Frequency [DATA_NEEDED: maximum core frequency MHz] 500 MHz
Supply Voltage (VCCINT) [DATA_NEEDED: VCCINT nominal V] —
Transceivers [DATA_NEEDED: number of embedded transceivers and max data rate] —
DSP Blocks [DATA_NEEDED: number of DSP blocks and precision] —
RoHS-Status Compliant (lead-free 'N' suffix) Compliant (per product listings)
Feuchtigkeitsempfindlichkeitsgrad (MSL) [DATA_NEEDED: MSL level per JEDEC J-STD-020] 3 (168 hours)
Configuration Method SRAM-based, configured via JTAG / passive / active serial / fast passive parallel —
Design Toolchain Altera Quartus II (legacy); Intel Quartus Prime —
Device Family — Stratix III Enhanced (Stratix III E)
Logic Elements — 255,000
Logic Array Blocks (LABs) — 10200
Embedded Memory — 16,672,768 bits (16.67 Mbit)
Operating Voltage (Core) — 0.9 V
Operating Voltage (Auxiliary) — 1.1 V
Speed Grade — C3
Packaging Type — Tray
Configuration Memory Support — Fast passive parallel, JTAG, Active Serial

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