EP3SE260H780I3N vs EP3SE260H780C2N Vergleich
Detaillierter Direktvergleich von EP3SE260H780I3N von Intel und EP3SE260H780C2N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SE260H780I3N - Stratix III E FPGA 255K LE 780-FCBGA | Intel
EP3SE260H780I3N ⚠ Letzte BestellmöglichkeitIntel
EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel
EP3SE260H780C2N ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP3SE260H780I3N | EP3SE260H780C2N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3.295,00 | $3.600,00 |
| Family | Stratix III E | — |
| Logic Elements (LE) | 255,000 | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| Embedded Memory (bits) | 16,672,768 | — |
| User I/Os | 488 | — |
| Operating Frequency (max) | 500 MHz | — |
| Process Technology | 65 nm CMOS | — |
| Core Supply Voltage (VCCINT) | 1.1 V | — |
| Anzahl der Pins | 780 | — |
| Gehäuse | 780-FBGA (HBGA, FCBGA) | 780-BGA FCBGA |
| Package Code | BGA780 | BGA |
| Montageart | Surface Mount (FCBGA) | Surface Mount |
| Temperature Grade | Industrial (-40C to +100C) | — |
| Speed Grade | 3 (mid) | C2 |
| RoHS-Status | Compliant | [DATA_NEEDED: rohs status] |
| Lead-Free / Halogen-Free | Lead-Free (per datasheet family) | — |
| Programmable Logic Type | SRAM-based FPGA | — |
| Series | — | Stratix III E |
| Logic Elements | — | 255,000 |
| LABs / CLBs | — | 10,200 |
| Total RAM Bits | — | 16,672,768 |
| User I/O Count | — | 488 |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count] |
| Core Voltage | — | 0.9 V |
| Betriebstemperaturbereich | — | Commercial (0C to +85C) |
| MSL-Level | — | 3 (168 hours) |
| Reflow Peak Time Max | — | 40 s |
| Lead-Free | — | [DATA_NEEDED: lead-free] |
| Terminal Form | — | Ball |
| Number of Terminals | — | 780 |
| Process Node | — | 40 nm |