EP3SE260H780I4 vs EP3SE260H780C4LN Vergleich
Detaillierter Direktvergleich von EP3SE260H780I4 von Intel und EP3SE260H780C4LN von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SE260H780C4LN - Stratix III E FPGA 255K LE 780-FCBGA | Intel
EP3SE260H780C4LN ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP3SE260H780I4 | EP3SE260H780C4LN |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.390,00 | $11.950,00 |
| Family | Stratix III Enhanced (Stratix III E) | Stratix III E |
| Logic Elements | 255,000 | 255,000 |
| Logic Cells | 255,000 | — |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Adaptive Logic Modules (ALMs) | approximately 203,200 | — |
| Maximum User I/Os | 488 | — |
| Process Technology | 65 nm CMOS | — |
| Core Voltage | 1.1 V | — |
| Embedded RAM (total) | approximately 14.4 Mbit (M9K/M144K blocks) | — |
| DSP Blocks | approximately 768 (18x18 multipliers) | — |
| Maximum Operating Frequency | up to 450 MHz core / 717 MHz per Partstack record | — |
| Gehäuse | 780-ball FC-HFBGA (HBGA) | 780-ball FCBGA (FineLine BGA) |
| Betriebstemperatur | -40C to +100C (industrial, 'I' grade) | 0C to +85C (commercial) |
| Speed Grade | 4 | C4 (commercial, moderate speed) |
| Montageart | Surface Mount (BGA) | — |
| Configuration Schemes | JTAG, Passive Serial, Fast Passive Parallel, Active Serial | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Embedded Memory | — | 16,672,768 bits (16.67 Mbit) |
| Embedded Multipliers (18x18) | — | 384 |
| User I/O Count | — | 488 |
| Core Voltage (VCC) | — | 1.0 V |
| I/O Voltage (VCCIO) | — | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| Auxiliary Voltage (VCCPD/VCCPT) | — | 2.5 V / 3.0 V |
| PLLs | — | 8 |
| Global Clock Networks | — | 16 |
| Process Node | — | 40 nm TSMC |
| Configuration Modes | — | FPP, AS, PS, JTAG |
| MSL-Level | — | 3 (168 hours) |