EP3SE50F484C3G vs EP3SE50F484C2N Vergleich
Detaillierter Direktvergleich von EP3SE50F484C3G von Intel und EP3SE50F484C2N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE50F484C3G | EP3SE50F484C2N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $205,00 | $5.934,83 |
| Family | Stratix III E | Stratix III E FPGA |
| Logic Elements | 47,500 | 47,500 |
| Adaptive Logic Modules (ALMs) | 19,000 | — |
| Total Embedded Memory | 5,760,000 bits (5.76 Mbit) | — |
| M9K Memory Blocks | 320 (2,304 Kbits) | — |
| M144K Memory Blocks | 12 (1,728 Kbits) | — |
| User I/O Pins | 296 | — |
| 18x18 Multipliers | 384 | — |
| PLLs | 4 | — |
| Global Clock Networks | 16 | — |
| Gehäuse | 484-ball FCBGA (F484), 1.0 mm pitch | 484-ball FCBGA (F484, 23x23 mm, 1.0 mm pitch) |
| Speed Grade | C3 | — |
| Betriebstemperatur | 0C to +85C (commercial, "C") | 0C to +85C (Commercial) |
| Process Node | 65 nm TSMC low-power | — |
| Core Voltage | 1.1 V | 0.9 V / 1.1 V |
| Montageart | Surface Mount | Surface Mount (BGA) |
| RoHS-Status | Compliant (lead-free) | Compliant |
| Series | — | Stratix III E |
| Embedded Memory | — | 2,304 Kbits |
| DSP Blocks (18x18) | — | 264 |
| User I/Os | — | 296 |
| LABs/CLBs | — | 1,900 |
| Internal Frequency | — | 600 MHz |
| Process Technology | — | 65 nm |
| Lead-Free | — | Yes |