EP3SE50F484C3N vs EP3SE50F484C2G Vergleich
Detaillierter Direktvergleich von EP3SE50F484C3N von Intel und EP3SE50F484C2G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SE50F484C2G - Stratix III E FPGA 47.5K LE 484-FBGA | Intel
EP3SE50F484C2G ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP3SE50F484C3N | EP3SE50F484C2G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $832,10 | $1.180,00 |
| Family | Stratix III E | — |
| Device Logic Elements | 47,500 | — |
| Logic Array Blocks (LABs) | 1,900 | — |
| Adaptive Logic Modules (ALMs) | 18,750 | — |
| Embedded Memory (Bits) | 5,760,000 | — |
| User I/Os | 296 | — |
| Maximum Internal Frequency | 717 MHz (typical); 800 MHz per DigChip | — |
| Process Technology | TSMC 40 nm low-power CMOS | 40 nm TSMC low-power CMOS |
| Gehäuse | 484-ball FBGA (FCBGA), 1.0 mm pitch | — |
| Versorgungsspannung | Core and I/O voltages per Stratix III E datasheet | — |
| Betriebstemperatur | 0C to +85 C (commercial, C suffix) | 0 °C to +85 °C (TJ) |
| Montageart | Surface Mount (BGA) | Surface Mount |
| MSL-Level | 3 (per JEDEC J-STD-020 for FCBGA packages) | — |
| RoHS-Status | Lead-free (per DigiKey listing) | Compliant |
| Configuration Mode | Passive Serial, Fast Passive Parallel, Fast Active Serial, JTAG | — |
| Design Software | Intel Quartus II (Stratix III support) | — |
| Lebenszyklusstatus | Obsolete (per Worldway listing 2026-04-05) | — |
| Series | — | Stratix III E |
| Number of Logic Elements / Cells | — | 47,500 |
| Number of LABs / CLBs | — | 1,900 |
| Total RAM Bits | — | 5,760,000 (5,760 Kbit) |
| Number of User I/O | — | 296 |
| Gehäuse / Bauform | — | 484-BBGA, FCBGA (FineLine BGA) |
| Core Voltage Supply | — | 0.86 V to 1.15 V |
| Logic Element Architecture | — | Adaptive Logic Module (ALM) with 8-input fracturable LUT |
| Embedded DSP Blocks | — | Yes (variable-precision multipliers) |
| Transceivers | — | Multi-gigabit transceivers (selected package pins) |
| Memory Interface Support | — | DDR / DDR2 / DDR3 with hard PHY |
| Partial Reconfiguration | — | Supported |
| Configuration Interface | — | JTAG, Passive Serial, Fast Passive Parallel |
| Part Status | — | Active (Intel catalogue); long-term supply subject to Stratix III lifecycle policy |