EP3SE50F484I3 vs EP3SE50F484C3N Vergleich

Detaillierter Direktvergleich von EP3SE50F484I3 von Intel und EP3SE50F484C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SE50F484I3 EP3SE50F484C3N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $188,00 $832,10
Family Stratix III E Stratix III E
Logic Elements 47,500 —
Logic Array Blocks (LABs) 1,900 1,900
Embedded Memory 5,760 Kbits —
User I/Os 296 296
Process Technology 65 nm TSMC 40 nm low-power CMOS
Core Voltage 1.1 V —
Gehäuse 484-ball FCBGA (FineLine BGA), 1.0 mm pitch 484-ball FBGA (FCBGA), 1.0 mm pitch
Operating Temperature Grade Industrial (-40 °C to +100 °C) —
Speed Grade I3 (-3 speed bin, industrial) —
DSP Blocks Yes (embedded multipliers and accumulators) —
Configuration Modes AS, PS, FPP, JTAG —
PLLs Yes (multiple, for clock management) —
I/O Standards LVDS, LVCMOS, LVTTL, HSTL, SSTL, PCI, PCI-X —
Transceivers Multi-gigabit transceivers supported —
Montageart Surface Mount (BGA) Surface Mount (BGA)
RoHS-Status Compliant Lead-free (per DigiKey listing)
Lead-Free Yes —
Device Logic Elements — 47,500
Adaptive Logic Modules (ALMs) — 18,750
Embedded Memory (Bits) — 5,760,000
Maximum Internal Frequency — 717 MHz (typical); 800 MHz per DigChip
Versorgungsspannung — Core and I/O voltages per Stratix III E datasheet
Betriebstemperatur — 0C to +85 C (commercial, C suffix)
MSL-Level — 3 (per JEDEC J-STD-020 for FCBGA packages)
Configuration Mode — Passive Serial, Fast Passive Parallel, Fast Active Serial, JTAG
Design Software — Intel Quartus II (Stratix III support)
Lebenszyklusstatus — Obsolete (per Worldway listing 2026-04-05)

Datenblätter & Ressourcen

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