EP3SE50F484I3 vs EP3SE50F484I3N Vergleich

Detaillierter Direktvergleich von EP3SE50F484I3 von Intel und EP3SE50F484I3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SE50F484I3 EP3SE50F484I3N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $188,00 $841,66
Family Stratix III E Stratix III E
Logic Elements 47,500 47,500
Logic Array Blocks (LABs) 1,900 —
Embedded Memory 5,760 Kbits —
User I/Os 296 —
Process Technology 65 nm 65 nm
Core Voltage 1.1 V —
Gehäuse 484-ball FCBGA (FineLine BGA), 1.0 mm pitch 484-pin FC-FBGA (flip-chip BGA)
Operating Temperature Grade Industrial (-40 °C to +100 °C) —
Speed Grade I3 (-3 speed bin, industrial) I3 (industrial, bin 3)
DSP Blocks Yes (embedded multipliers and accumulators) [DATA_NEEDED: number of DSP blocks]
Configuration Modes AS, PS, FPP, JTAG —
PLLs Yes (multiple, for clock management) —
I/O Standards LVDS, LVCMOS, LVTTL, HSTL, SSTL, PCI, PCI-X —
Transceivers Multi-gigabit transceivers supported —
Montageart Surface Mount (BGA) Surface Mount (BGA)
RoHS-Status Compliant —
Lead-Free Yes —
Number of LABs — 1,900
Total Memory Bits — 5,760,000
Maximum User I/O — 296
Number of I/O Banks — [DATA_NEEDED: number of I/O banks]
Core Voltage VCC — 0.9 V
Auxiliary Voltage VCCAUX — 1.1 V
Maximum Internal Frequency — 500 MHz
Betriebstemperatur — -40C to +100C (industrial)
Lead-Free / RoHS — Yes (N suffix)
Configuration Method — Active serial (AS), passive serial (PS), JTAG, fast passive parallel (FPP)
Embedded Multipliers (18x18) — [DATA_NEEDED: number of 18x18 multipliers]
Transceiver Count — [DATA_NEEDED: number of embedded transceivers]

Datenblätter & Ressourcen

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