EP3SE50F484I3 vs EP3SL50F484I3 Vergleich

Detaillierter Direktvergleich von EP3SE50F484I3 von Intel und EP3SL50F484I3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SE50F484I3 EP3SL50F484I3
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $188,00 $701,23
Family Stratix III E Stratix III L (Low Power)
Logic Elements 47,500 —
Logic Array Blocks (LABs) 1,900 1,900
Embedded Memory 5,760 Kbits —
User I/Os 296 —
Process Technology 65 nm 65 nm
Core Voltage 1.1 V 1.1 V
Gehäuse 484-ball FCBGA (FineLine BGA), 1.0 mm pitch 484-ball FC-FBGA (Flip-Chip FineLine BGA)
Operating Temperature Grade Industrial (-40 °C to +100 °C) —
Speed Grade I3 (-3 speed bin, industrial) —
DSP Blocks Yes (embedded multipliers and accumulators) —
Configuration Modes AS, PS, FPP, JTAG —
PLLs Yes (multiple, for clock management) —
I/O Standards LVDS, LVCMOS, LVTTL, HSTL, SSTL, PCI, PCI-X —
Transceivers Multi-gigabit transceivers supported Stratix III L — supports high-speed serial transceivers per family datasheet
Montageart Surface Mount (BGA) Surface Mount
RoHS-Status Compliant —
Lead-Free Yes —
Device Logic Elements — 47,500
Embedded Memory (bits) — 2,184,192
Maximum User I/O — 296
Internal Operating Frequency — 500 MHz
Betriebstemperatur — 0 °C to +85 °C (commercial)
Lead-Free / RoHS — [DATA_NEEDED: lead-free/RoHS status]
MSL-Level — [DATA_NEEDED: MSL level]
Configuration Scheme — SRAM-based (volatile, requires external config device)

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