EP3SE50F484I4L vs EP3SE50F484I3N Vergleich
Detaillierter Direktvergleich von EP3SE50F484I4L von Intel und EP3SE50F484I3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SE50F484I4L - Stratix III E FPGA, 47.5K LE, 484-FBGA | Intel
EP3SE50F484I4L ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP3SE50F484I4L | EP3SE50F484I3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.290,00 | $841,66 |
| Family | Stratix III E | Stratix III E |
| Logic Elements (LE) | 47,500 | — |
| Logic Array Blocks (LABs) | 1,900 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 5,760 Kbit (5.625 Mbit) | — |
| Embedded Multipliers (18x18) | 384 | [DATA_NEEDED: number of 18x18 multipliers] |
| Maximum User I/O | 296 | 296 |
| Maximum Core Clock | 717 MHz (per third-party listing) | — |
| Speed Grade | 4 (slowest) | I3 (industrial, bin 3) |
| Betriebstemperaturbereich | Industrial (I): -40C to +100C junction | — |
| Process Node | 40 nm CMOS | — |
| Gehäuse | 484-ball FCBGA (FBGA-484) | 484-pin FC-FBGA (flip-chip BGA) |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Versorgungsspannung | Multiple rails: core 0.9V, I/O 1.2V-3.3V (per Stratix III handbook) | — |
| Configuration Method | Quartus II / EPCS serial / parallel | Active serial (AS), passive serial (PS), JTAG, fast passive parallel (FPP) |
| Lead-Free (Pb-free) | Yes (L suffix) | — |
| RoHS-Status | Compliant | — |
| MSL-Level | MSL3 (per JEDEC J-STD-020, typical for FBGA-484) | — |
| Logic Elements | — | 47,500 |
| Number of LABs | — | 1,900 |
| Total Memory Bits | — | 5,760,000 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Core Voltage VCC | — | 0.9 V |
| Auxiliary Voltage VCCAUX | — | 1.1 V |
| Process Technology | — | 65 nm |
| Maximum Internal Frequency | — | 500 MHz |
| Betriebstemperatur | — | -40C to +100C (industrial) |
| Lead-Free / RoHS | — | Yes (N suffix) |
| DSP Blocks | — | [DATA_NEEDED: number of DSP blocks] |
| Transceiver Count | — | [DATA_NEEDED: number of embedded transceivers] |