EP3SE50F780C3 vs EP3SE50F780C4L Vergleich
Detaillierter Direktvergleich von EP3SE50F780C3 von Intel und EP3SE50F780C4L von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE50F780C3 | EP3SE50F780C4L |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $890,00 | $1.320,00 |
| Family | Stratix III E | Stratix III |
| Logic Elements (LE) | 47,500 | 47,500 |
| Embedded Memory (BRAM) | 5,760 Kbits | — |
| User I/Os | 488 | 488 |
| Gehäuse | 780-ball FC-FBGA (FineLine BGA) | 780-ball FCBGA (Flip-Chip BGA) |
| Process Technology | 65 nm | — |
| Core Voltage | 1.1 V | 1.1 V |
| Logic Voltage | 0.9 V | — |
| Transceiver Speed (max) | 500 MHz | — |
| Total LABs/CLBs | 1900 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | — |
| Montageart | Surface Mount (BGA) | — |
| Betriebstemperatur | 0C to +85C (Commercial grade, 'C' suffix) | [DATA_NEEDED: full industrial/commercial grade] |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant (lead-free) |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| Series | — | Stratix III E |
| Embedded Memory | — | 5,760,000 bits |
| DSP Blocks (18x18 multipliers) | — | 304 (19x16) |
| Process Node | — | 40 nm |
| Speed Grade | — | C4 (commercial, speed 4) |
| Lead-Free (L suffix) | — | Yes |
| Configuration Method | — | Passive Serial / Fast Passive Parallel / JTAG / Enhanced |
| Transceivers | — | [DATA_NEEDED: per Stratix III E variant] |
| PLLs | — | [DATA_NEEDED: PLL count] |