EP3SE50F780C4G vs EP3SE110F780C4 Vergleich
Detaillierter Direktvergleich von EP3SE50F780C4G von Intel und EP3SE110F780C4 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SE50F780C4G - Stratix III E FPGA, 47.5K LE, 488 I/O, 780-FBGA | Intel
EP3SE50F780C4G ✓ AktivSpezifikationsvergleich
| Parameter | EP3SE50F780C4G | EP3SE110F780C4 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $593,00 | $2.380,00 |
| Family | Stratix III E | Stratix III E |
| Series | Stratix III | — |
| Logic Elements | 47,500 LE | 107,500 |
| Adaptive Logic Modules (ALMs) | 19,000 ALM | — |
| Embedded Memory | 5.76 Mbit (5760000 bit) | 8,936,448 bits (8.9 Mbit) |
| Number of I/Os | 488 | — |
| Number of Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count from datasheet] | — |
| Number of Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| Process Technology | 40 nm TSMC | — |
| Core Supply Voltage | 1.1 V | — |
| Betriebstemperaturbereich | 0 C to +85 C (commercial) | — |
| Gehäuse | 780-ball FBGA (FCBGA) | 780-ball FCBGA (FineLine BGA) |
| Montageart | Surface Mount (SMD/SMT) | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | — |
| MSL-Level | MSL3 (per JEDEC J-STD-020) | — |
| Configuration Memory | SRAM-based (volatile, requires configuration device) | — |
| Design Software | Quartus II | — |
| Logic Array Blocks (LABs) | — | 4,300 |
| DSP Blocks (18x18 Multipliers) | — | 896 |
| Maximum User I/O | — | 488 |
| Speed Grade | — | C4 |
| Process Node | — | 40 nm |
| Transceiver Data Rate | — | Up to 1.6 Gbps |
| Memory Interface Support | — | DDR3 up to 800 MHz |
| Betriebstemperatur | — | Commercial (0C to +85C) |
| Configuration | — | Partial Reconfiguration support |