EP3SE50F780I3G vs EP3SE110F780I4LN Vergleich
Detaillierter Direktvergleich von EP3SE50F780I3G von Intel und EP3SE110F780I4LN von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE50F780I3G | EP3SE110F780I4LN |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.082,02 | $1.920,00 |
| Family | Stratix III E | — |
| Logic Elements (LE) | 47,500 | — |
| Adaptive Logic Modules (ALM) | 19,000 | — |
| Embedded Memory | 8.7 Mbits (M9K + M144K blocks) | — |
| DSP Blocks | 264 (18x18 multipliers) | Yes (DSP-intensive architecture) |
| Maximum User I/O Pins | 488 | — |
| Transceivers | 12 channels, up to 3.75 Gbps | Multi-gigabit embedded transceivers |
| Core Voltage | 1.1 V | 0.9 V |
| Process Technology | TSMC 40 nm | 40 nm CMOS |
| Gehäuse | 780-pin FC-FBGA (F780) 29x29 mm | 780-BBGA, FCBGA (FBGA-780) |
| Betriebstemperatur | -40C to +100C (Industrial, I3) | -40C to +100C (Industrial) |
| Speed Grade | 3 | — |
| Memory Interfaces | DDR3 up to 800 MHz, DDR2, QDR II+ SRAM | — |
| PCI Express Hard IP | Gen1 x1/x4/x8 | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| MSL-Level | 3 | — |
| RoHS-Status | Compliant | — |
| Lead-Free | Yes | — |
| Series | — | Stratix III E |
| Logic Elements | — | 107,500 |
| Logic Array Blocks (LABs) | — | 4,300 |
| Total Memory Bits | — | 8,936,448 |
| User I/O Count | — | 488 |
| Maximum Operating Frequency | — | 717 MHz |
| Lead-Free / RoHS Status | — | Lead-free / RoHS compliant |
| Embedded Memory Type | — | M20K + MLAB |