EP3SE80F1152C2 vs EP3SE110F1152C2 Vergleich
Detaillierter Direktvergleich von EP3SE80F1152C2 von Intel und EP3SE110F1152C2 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SE110F1152C2 - Stratix III E FPGA, 107K LE, 1152-FCBGA | Intel
EP3SE110F1152C2 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP3SE80F1152C2 | EP3SE110F1152C2 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.325,00 | $4.100,00 |
| Family | Stratix III E | Stratix III E (Enhanced) |
| Logic Elements | 80,000 | 107,500 |
| Logic Array Blocks (LABs) | 3,200 | 4,300 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | 53,750 |
| Embedded Memory Bits | 6,843,392 | — |
| User I/Os | 744 | — |
| Process Technology | 65 nm | 65 nm |
| Core Voltage (VCCINT) | 1.1 V | — |
| Internal Operating Frequency | up to 600 MHz | — |
| Betriebstemperatur | 0 C to 85 C (Commercial) | 0C to 85C (Commercial) |
| Speed Grade | C2 | — |
| Gehäuse | 1152-ball FC-FBGA (Flip Chip FineLine BGA) | 1152-ball FC-BGA |
| Package Code | F1152 | F1152 |
| Montageart | Surface Mount | Surface Mount (BGA) |
| RoHS-Status | Compliant | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL rating] | — |
| Embedded Memory (bits) | — | 8,936,448 |
| Maximum User I/Os | — | 744 |
| Core Voltage | — | 0.9 V |
| Maximum Internal Frequency | — | 800 MHz |
| Device Type | — | FPGA |
| Configuration | — | SRAM-based, volatile (requires configuration device) |