EP3SE80F1152C3N vs EP3SE80F1152C2 Vergleich
Detaillierter Direktvergleich von EP3SE80F1152C3N von Intel und EP3SE80F1152C2 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE80F1152C3N | EP3SE80F1152C2 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.690,00 | $1.325,00 |
| Series | Stratix III E | — |
| Logic Elements (LEs) | 80,000 | — |
| Total Memory Bits | 6,843,392 bits | — |
| Number of LABs/CLBs | 3200 | — |
| Number of User I/O | 744 | — |
| Anzahl der Ausgänge | 744 | — |
| Gehäuse / Bauform | 1152-BBGA, FCBGA (FineLine BGA) | — |
| Betriebstemperatur | 0C to +85C (commercial, C3 grade) | 0 C to 85 C (Commercial) |
| Speed/Power Grade | C3 | — |
| Process Technology | 40 nm CMOS | 65 nm |
| Montageart | Surface Mount | Surface Mount |
| Lead Free | Yes | — |
| MSL-Level | 3 (per JEDEC J-STD-020) | — |
| Configuration Memory | SRAM-based, volatile (needs external config device) | — |
| RoHS-Status | Compliant | Compliant |
| Family | — | Stratix III E |
| Logic Elements | — | 80,000 |
| Logic Array Blocks (LABs) | — | 3,200 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory Bits | — | 6,843,392 |
| User I/Os | — | 744 |
| Core Voltage (VCCINT) | — | 1.1 V |
| Internal Operating Frequency | — | up to 600 MHz |
| Speed Grade | — | C2 |
| Gehäuse | — | 1152-ball FC-FBGA (Flip Chip FineLine BGA) |
| Package Code | — | F1152 |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL rating] |