EP3SE80F1152C4 vs EP3SE80F1152C3N Vergleich
Detaillierter Direktvergleich von EP3SE80F1152C4 von Intel und EP3SE80F1152C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE80F1152C4 | EP3SE80F1152C3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $895,00 | $1.690,00 |
| Series | Stratix III E | Stratix III E |
| Family | Stratix III Enhanced | — |
| Device Type | FPGA | — |
| Logic Elements | 80,000 | — |
| Logic Array Blocks (LABs) | 3200 | — |
| Total RAM Bits | 6,843,392 | — |
| User I/Os | 744 | — |
| Core Voltage | 1.1 V | — |
| Process Technology | 65 nm CMOS | 40 nm CMOS |
| Internal Frequency (max) | 800 MHz | — |
| Betriebstemperatur | 0C to +85C (Commercial) | 0C to +85C (commercial, C3 grade) |
| Gehäuse | 1152-ball FC-FBGA (Fine-pitch Chip-scale BGA) | — |
| Montageart | Surface Mount | Surface Mount |
| Configuration Method | SRAM-based, JTAG / EPCS serial | — |
| DSP Blocks | Yes (variable-precision, 18x18 multipliers) | — |
| RoHS-Status | Compliant | Compliant |
| Logic Elements (LEs) | — | 80,000 |
| Total Memory Bits | — | 6,843,392 bits |
| Number of LABs/CLBs | — | 3200 |
| Number of User I/O | — | 744 |
| Anzahl der Ausgänge | — | 744 |
| Gehäuse / Bauform | — | 1152-BBGA, FCBGA (FineLine BGA) |
| Speed/Power Grade | — | C3 |
| Lead Free | — | Yes |
| MSL-Level | — | 3 (per JEDEC J-STD-020) |
| Configuration Memory | — | SRAM-based, volatile (needs external config device) |