EP3SE80F1152C4LN vs EP3SE80F1152I3N Vergleich
Detaillierter Direktvergleich von EP3SE80F1152C4LN von Intel und EP3SE80F1152I3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SE80F1152I3N - Stratix III E FPGA 80K LE, 1152-FCBGA | Intel
EP3SE80F1152I3N ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP3SE80F1152C4LN | EP3SE80F1152I3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.907,77 | $1.395,00 |
| Series | Stratix III E | — |
| Logic Elements (LE) | 80,000 | — |
| LABs / CLBs | 3200 | — |
| Embedded Memory (bits) | 6,843,392 | — |
| Total RAM Bits | 6,843,392 | — |
| User I/O (per datasheet) | 744 | — |
| User I/O (JAK comparison) | 488 (alternate listing) | — |
| Operating Frequency (max) | 717 MHz | — |
| Number of GPIOs | 744 | — |
| Versorgungsspannung | 0.9 V to 1.1 V core (with 2.5 V / 3.0 V aux) | — |
| Process Technology | CMOS | 65 nm |
| Gehäuse | 1152-BBGA, FCBGA (FBGA-1152) | 1152-ball FCBGA (Flip-Chip BGA) |
| Montageart | Surface Mount | Surface Mount |
| Lead Free | Yes | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature grade] | -40 °C to +100 °C (Industrial) |
| Family | — | Stratix III E |
| Logic Elements | — | 80,000 |
| Logic Array Blocks (LABs) | — | 3,200 |
| Embedded Memory Bits | — | 6,843,392 |
| Maximum User I/O | — | 744 |
| Core Voltage | — | 1.1 V |
| Auxiliary Supply Voltages | — | 1.2 V, 3.3 V |
| Maximum Internal Clock Frequency | — | 500 MHz |
| Speed Grade | — | I3 |
| Configuration Mode | — | JTAG / Passive Serial / Fast Passive Parallel |
| Configuration Encryption | — | AES-128 bitstream encryption supported |
| RoHS-Status | — | [DATA_NEEDED: rohs status] |