EP3SE80F780C3N vs EP3SE80F780C4LN Vergleich
Detaillierter Direktvergleich von EP3SE80F780C3N von Intel und EP3SE80F780C4LN von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE80F780C3N | EP3SE80F780C4LN |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.410,00 | $138,75 |
| Family | Stratix III | Stratix III E |
| Logic Elements | 80,000 | — |
| Number of LABs | 3200 | — |
| Number of I/Os | 488 | — |
| Package Type | FBGA-780 (FineLine BGA) | — |
| Process Technology | 40 nm CMOS | 65 nm |
| Versorgungsspannung | 0.9 V core | — |
| Betriebstemperatur | 0 °C to 85 °C (commercial) | — |
| Internal Frequency (max) | 717 MHz | — |
| Speed Grade | C3 | C4 |
| Lead-Free | Yes (Pb-free) | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Memory Subsystem | TriMatrix embedded memory | — |
| DSP Blocks | Yes, dedicated DSP blocks | — |
| RoHS-Status | Compliant | — |
| Total Pins | 780 | — |
| Logic Elements (LE) | — | 80,000 |
| Logic Array Blocks (LABs) | — | 3,200 |
| Total Embedded Memory | — | 6,843,392 bits (approximately 6.5 Mbit) |
| User I/O Count | — | 488 |
| Maximum Operating Frequency | — | 375 MHz |
| Core Voltage (VCCINT) | — | 0.9 V |
| Gehäuse | — | 780-ball FC-FBGA (Flip-Chip Fine-pitch BGA) |
| Operating Temperature Grade | — | Commercial (C suffix) |
| Lead-Free / RoHS | — | Yes (LN suffix) |
| Configuration Scheme | — | Active Serial / Passive Parallel / Fast Passive Parallel |
| Hard IP Blocks | — | PCIe Gen1, GbE MAC/PHY, DDR2/DDR3 controllers |