EP3SE80F780C4N vs EP3SE260H780C4N Vergleich
Detaillierter Direktvergleich von EP3SE80F780C4N von Intel und EP3SE260H780C4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE80F780C4N | EP3SE260H780C4N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.290,00 | $1.395,00 |
| Device Family | Stratix III E | — |
| Logic Elements | 80,000 | 255,000 |
| Logic Array Blocks (LABs) | 3,200 | 10,200 |
| User I/Os | 488 | — |
| Embedded Memory (bits) | 6,843,392 | — |
| Process Technology | 65 nm | — |
| Core Voltage | 0.9 V | 0.86 V to 1.15 V |
| I/O Voltage | 1.1 V | — |
| Gehäuse | 780-ball FC-FBGA (FineLine BGA) | 780-ball FCBGA (Flip Chip BGA) |
| Pin/Package Code | F780 | — |
| Speed Grade | C4 (commercial) | — |
| Internal Frequency (max) | [DATA_NEEDED: internal max frequency per datasheet] | — |
| Betriebstemperatur | 0 C to 85 C (commercial) | 0C to +85C (commercial) |
| Montageart | Surface Mount | Surface Mount |
| Configuration Method | Serial/Parallel (Quartus II) | Serial/Parallel via Quartus II |
| RoHS-Status | Compliant | — |
| MSL-Level | [DATA_NEEDED: MSL rating] | — |
| Family | — | Stratix III E (Enhanced) |
| Total RAM Bits | — | 16,672,768 |
| Embedded Memory | — | M9K and M144K blocks |
| User I/O Pins | — | 488 |
| DSP Blocks (18x18 Multipliers) | — | 768 |
| PLLs | — | 12 |
| Process Node | — | 65 nm CMOS |
| Maximum Core Clock Frequency | — | 450 MHz |
| Feuchtigkeitsempfindlichkeitsgrad (MSL) | — | 3 (168 hours) |