EP3SL200H780C2N vs EP3SL200H780C3N Vergleich
Detaillierter Direktvergleich von EP3SL200H780C2N von Intel und EP3SL200H780C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SL200H780C2N | EP3SL200H780C3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $6.050,00 | $4.995,00 |
| Family | Stratix III L | Stratix III L (low-power) |
| Logic Elements | 200,000 | 200,000 |
| Adaptive Logic Modules (ALMs) | 80,000 | — |
| User I/O Count | 488 | — |
| Embedded Memory Bits | 10,901,504 | 10,901,504 bits |
| Process Technology | 65 nm CMOS | — |
| Core Voltage | 1.1 V | — |
| Maximum Internal Frequency | 800 MHz | — |
| Speed Grade | C2 | C3 (commercial, -3 speed) |
| Transceivers | Per family capability - not specified for this OPN | 24 channels, up to 3.75 Gbps |
| Gehäuse | 780-ball HBGA / FCBGA | 780-Ball FCBGA (HBGA), 29 x 29 mm |
| Package Code | PBGA780 / HBGA-780 | — |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | Commercial (0C to +85C) | 0C to +85C (commercial) |
| Lead Free | Yes | — |
| RoHS-Status | Compliant | — |
| Process Node | — | 40 nm |
| Logic Array Blocks (LABs) | — | 8,000 |
| User I/Os | — | 488 |
| Maximum Internal Clock Frequency | — | 800 MHz |
| DSP Blocks | — | 384 |
| Voltage - Core | — | 0.9 V / 1.0 V (core, VCC) |
| Voltage - I/O | — | 1.2 V to 3.3 V (VCCIO banks) |
| MSL-Level | — | 3 |
| Lead-Free / RoHS | — | Yes |
| Mounting Pitch | — | 1.0 mm ball pitch |
| PLLs | — | 12 (Stratix III PLL array) |
| Configuration | — | JTAG IEEE Std 1149.1, passive/active serial |