EP3SL200H780I3 vs EP3SL200H780I3N Vergleich
Detaillierter Direktvergleich von EP3SL200H780I3 von Intel und EP3SL200H780I3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SL200H780I3 | EP3SL200H780I3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $7.980,00 | $7.200,00 |
| Series | Stratix III L | — |
| Family | Stratix III | Stratix III L |
| Logic Elements | 200,000 | 200,000 |
| LABs (Logic Array Blocks) | 8000 | — |
| Total RAM Bits | 10,901,504 (10,900 Kb) | — |
| User I/O Count | 488 | — |
| Number of I/O Banks | [DATA_NEEDED: I/O banks] | — |
| Embedded Multipliers (DSP blocks) | 384 (18x18) | — |
| PLLs | 12 | — |
| Process Technology | 65 nm CMOS | — |
| Core Voltage | 1.1 V | — |
| Maximum Operating Frequency | 717 MHz | — |
| Betriebstemperatur | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Gehäuse | 780-BBGA, FCBGA (HBGA-780) | 780-BBGA, FCBGA |
| Montageart | Surface Mount | Surface Mount |
| Supplier Device Package | 780-FBGA (29x29 mm) | — |
| Lead-Free / RoHS | Compliant (lead-free) | — |
| RAM Bits | — | 10,901,504 |
| User I/O | — | 488 |
| Package Pin Count | — | 780 |
| Supply Voltage (Core) | — | 0.9 V |
| Technology | — | CMOS, 40 nm |
| Process Node | — | 40 nm |
| Number of Terminals | — | 780 |
| Case / Package Code | — | BGA-780 |
| RoHS-Status | — | Compliant |
| Lead-Free | — | Yes |