EP3SL50F484C2G vs EP3SL50F484C2 Vergleich
Detaillierter Direktvergleich von EP3SL50F484C2G von Intel und EP3SL50F484C2 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SL50F484C2 - 47.5K LE Stratix III L FPGA 484-FBGA | Intel
EP3SL50F484C2 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP3SL50F484C2G | EP3SL50F484C2 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $335,00 | $478,80 |
| Family | Stratix III L | Stratix III L (low-power) |
| Logic Elements | 47,500 LE | 47,500 |
| Adaptive Logic Modules (ALMs) | 19,000 ALM | — |
| Embedded Memory | 2,184,192 bits (2.08 Mbit) | — |
| Maximum User I/Os | 296 I/O | — |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | — |
| Operating Supply Voltage (Core) | 1.1 V | — |
| Maximum Operating Temperature | +85 C | — |
| Minimum Operating Temperature | 0 C | — |
| Maximale Taktfrequenz | 600 MHz | — |
| Process Technology | 65 nm CMOS | 40 nm CMOS (TSMC) |
| Gehäuse | 484-ball FCBGA (FBGA-484) | 484-BBGA, FCBGA (FineLine BGA) |
| Montagestil | SMD/SMT | — |
| Packaging | Tray | — |
| RoHS-Status | Compliant | Compliant |
| Total Transceivers | [DATA_NEEDED: transceiver count] | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| Device Type | — | FPGA |
| Logic Array Blocks (LABs) | — | 1,900 |
| Embedded Memory Bits | — | 2,184,192 |
| Maximum Internal Frequency | — | 800 MHz |
| User I/O Pins | — | 296 |
| Core Supply Voltage | — | 0.9 V |
| Betriebstemperatur | — | 0 C to 85 C (commercial) |
| Montageart | — | Surface Mount |
| Lead-Free | — | Yes |
| Configuration Memory | — | SRAM-based (volatile, requires external flash/EPC) |
| Speed Grade | — | C2 (slower of Stratix III commercial) |