EP3SL50F484I4 vs EP3SE50F484I3N Vergleich

Detaillierter Direktvergleich von EP3SL50F484I4 von Intel und EP3SE50F484I3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SL50F484I4 EP3SE50F484I3N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $558,00 $841,66
Device Family Stratix III L —
Logic Elements (LE) 47,500 —
Logic Array Blocks (LABs) 1,900 —
Embedded Memory Bits 2,184,192 bits —
Maximum User I/O 296 296
Process Technology 65 nm CMOS 65 nm
Internal Frequency 800 MHz (max, per digchip datasheet summary) —
Core Supply Voltage 1.1 V —
Gehäuse 484-ball FC-FBGA (FCBGA, 1.0 mm pitch) 484-pin FC-FBGA (flip-chip BGA)
Betriebstemperatur -40C to +100C (industrial) -40C to +100C (industrial)
Grade Suffix I4 = Industrial, speed grade 4 —
Configuration Modes JTAG, Passive Serial, FPP, PPA —
MultiTrack Interconnect Yes —
TriMatrix Embedded Memory MLAB, M9K, M144K blocks —
Montageart Surface Mount (BGA) Surface Mount (BGA)
MSL-Level 3 (168 hours) —
RoHS-Status Compliant —
Lead-Free Yes —
Family — Stratix III E
Logic Elements — 47,500
Number of LABs — 1,900
Total Memory Bits — 5,760,000
Number of I/O Banks — [DATA_NEEDED: number of I/O banks]
Core Voltage VCC — 0.9 V
Auxiliary Voltage VCCAUX — 1.1 V
Maximum Internal Frequency — 500 MHz
Speed Grade — I3 (industrial, bin 3)
Lead-Free / RoHS — Yes (N suffix)
Configuration Method — Active serial (AS), passive serial (PS), JTAG, fast passive parallel (FPP)
DSP Blocks — [DATA_NEEDED: number of DSP blocks]
Embedded Multipliers (18x18) — [DATA_NEEDED: number of 18x18 multipliers]
Transceiver Count — [DATA_NEEDED: number of embedded transceivers]

Datenblätter & Ressourcen

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