EP3SL50F780C2 vs EP3SL70F780C2G Vergleich
Detaillierter Direktvergleich von EP3SL50F780C2 von Intel und EP3SL70F780C2G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SL50F780C2 | EP3SL70F780C2G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $199,95 | $1.185,00 |
| Family | Stratix III L | Stratix III L |
| Logic Elements (LE) | 47,500 | — |
| Logic Array Blocks (LABs) | 1,900 | — |
| Embedded Memory (bits) | 2,184,192 | — |
| Maximum User I/Os | 488 | — |
| Core Voltage | 1.1 V | — |
| Process Technology | 65 nm | — |
| Gehäuse | 780-ball FCBGA (Flip-Chip BGA) | 780-ball FCBGA (FineLine BGA) |
| Betriebstemperatur | 0°C to +85°C (commercial) | — |
| Maximum Core Frequency | 600 MHz | — |
| Configuration Interface | JTAG / passive serial / fast passive parallel | — |
| I/O Standards | LVDS, LVCMOS, SSTL, HSTL, DDR2/DDR3 memory interfaces | — |
| Embedded Memory Type | TriMatrix (MLAB, M9K, M144K blocks) | — |
| RoHS-Status | Compliant | Compliant |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Logic Elements | — | 67,500 |
| Embedded Memory | — | 2,699,264 bits |
| User I/O Count | — | 488 |
| Speed Grade | — | C2 (medium) |
| Temperature Grade | — | Commercial (0 C to 85 C) |
| Process Node | — | 40 nm low-power CMOS |
| Core Voltage (VCC) | — | 0.9 V |
| DSP Blocks | — | Yes (dedicated) |
| Memory Interfaces Supported | — | DDR3, DDR2, QDR II+, RLDRAM II |
| PCIe Hard IP | — | Gen1/Gen2 |
| Transceivers | — | [DATA_NEEDED: transceiver count and data rate] |
| PLLs | — | Fractional PLLs |