EP3SL50F780C3 vs EP3SL50F780C4G Vergleich
Detaillierter Direktvergleich von EP3SL50F780C3 von Intel und EP3SL50F780C4G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SL50F780C3 - Stratix III L FPGA, 47.5K LE, 780-FBGA | Intel / Altera
EP3SL50F780C3 ⚠ Letzte Bestellmöglichkeit
Spezifikationsvergleich
| Parameter | EP3SL50F780C3 | EP3SL50F780C4G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $540,00 | $499,40 |
| Family | Stratix III L (low-power) | Stratix III L |
| Series | Stratix III | EP3SL50 |
| Logic Elements | 47,500 | 47,500 |
| Logic Array Blocks (LABs) | 1,900 | — |
| Embedded Memory Bits | 2,184,192 | 2,184,192 |
| User I/Os | 488 | — |
| Package Type | 780-BBGA, FCBGA (FineLine) | — |
| Device Pin Count | 780 | — |
| Betriebstemperatur | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Speed Grade | 3 | 4 |
| Supply Voltage (Core) | [DATA_NEEDED: VCCINT nominal value] | — |
| PLLs | 12 | 4 |
| Global Clock Networks | 24 | — |
| Process Node | 65 nm TSMC | — |
| Configuration Method | SRAM-based, supports Partial Reconfiguration | FPP / FAS / JTAG |
| RoHS-Status | Compliant | Compliant |
| Lead-Free / Halogen-Free | Lead-Free (per package marking); Halogen-Free status unknown | — |
| Feuchtigkeitsempfindlichkeitsgrad (MSL) | MSL3 (per JEDEC J-STD-020, typical for large FBGA) | — |
| Maximum User I/Os | — | 488 |
| Process Technology | — | 65 nm |
| Core Voltage (VCC) | — | 1.1 V |
| Gehäuse | — | 780-ball FC-FBGA |
| Montageart | — | Surface Mount |
| Lead-Free | — | Yes |