EP3SL70F780C4L vs EP3SL70F780C2G Vergleich
Detaillierter Direktvergleich von EP3SL70F780C4L von Intel und EP3SL70F780C2G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SL70F780C4L | EP3SL70F780C2G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $944,74 | $1.185,00 |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix III L | — |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements (LE) | 67,500 | — |
| Total Memory Bits | 2,699,264 bits (~2.7 Mb) | — |
| Logic Array Blocks (LABs) | 2,700 | — |
| Maximum User I/O | 488 | — |
| Process Technology | 65 nm | — |
| Internal Frequency (max) | [DATA_NEEDED: internal frequency] | — |
| Core Voltage (VCC) | 0.9 V | 0.9 V |
| Speed Grade | C4 | C2 (medium) |
| Betriebstemperatur | 0C to 85C (commercial) | — |
| Package Type | 780-BBGA, FC-FBGA (Flip-Chip) | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Lead Free / RoHS | Yes (lead-free per BGA package) | — |
| Configuration Method | JTAG, Passive Serial, FPP, external memory | — |
| Design Software | Quartus II (Stratix III device support) | — |
| Family | — | Stratix III L |
| Logic Elements | — | 67,500 |
| Embedded Memory | — | 2,699,264 bits |
| User I/O Count | — | 488 |
| Gehäuse | — | 780-ball FCBGA (FineLine BGA) |
| Temperature Grade | — | Commercial (0 C to 85 C) |
| Process Node | — | 40 nm low-power CMOS |
| DSP Blocks | — | Yes (dedicated) |
| Memory Interfaces Supported | — | DDR3, DDR2, QDR II+, RLDRAM II |
| PCIe Hard IP | — | Gen1/Gen2 |
| Transceivers | — | [DATA_NEEDED: transceiver count and data rate] |
| PLLs | — | Fractional PLLs |
| RoHS-Status | — | Compliant |