EP3SL70F780I4L vs EP3SL50F780I4L Vergleich
Detaillierter Direktvergleich von EP3SL70F780I4L von Intel und EP3SL50F780I4L von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SL70F780I4L | EP3SL50F780I4L |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.150,00 | $695,09 |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 67,500 | 47,500 |
| Logic Array Blocks (LABs) | 2,700 | — |
| Embedded Memory Bits | 2,699,264 | — |
| User I/O Pins | 488 | — |
| Gehäuse | 780-ball FBGA (FineLine BGA) | 780-BBGA, FCBGA (29 mm) |
| Betriebstemperatur | -40C to +100C (industrial) | -40C to +100C (Industrial) |
| Speed Grade | I4 | I4 |
| Power Variant | L (low static power) | — |
| Process Node | 40 nm | — |
| Configuration Method | Serial / Parallel / JTAG via Quartus II | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| Transceivers | None (logic/transceiver-less L variant) | — |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS-Status | Compliant | — |
| Embedded Memory (bits) | — | 2,184,192 |
| User I/O Count | — | 488 |
| I/O Banks | — | 8 |
| Process Technology | — | 65 nm CMOS |
| Core Voltage | — | 0.9 V |
| Lead-Free / RoHS | — | Yes (L suffix) |
| MSL-Level | — | [DATA_NEEDED: MSL moisture sensitivity level] |
| Configuration Memory | — | SRAM-based, volatile |
| Design Suite | — | Quartus II / Quartus Prime (Stratix III support) |
| Device Sub-Family | — | Low-Power (L) |
| Country of Origin | — | [DATA_NEEDED: COO not specified in source data] |