EP4CE115F23I7N vs EP4CE75F23C7 Vergleich
Detaillierter Direktvergleich von EP4CE115F23I7N von Intel und EP4CE75F23C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE115F23I7N | EP4CE75F23C7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $87,95 | $148,00 |
| Series | Cyclone IV E | — |
| Family | EP4CE115 (F23 package) | Cyclone IV E |
| Logic Elements (LE) | 114,480 | — |
| Embedded Memory Bits | 3,981,312 bits | 2,810,880 bits |
| Maximum User I/Os | 280 | — |
| Logic Array Blocks (LABs) | 7,180 | 4,713 |
| Number of PLLs | 4 | — |
| 18x18 Hardware Multipliers | 266 | — |
| Core Voltage | 1.0 V / 1.2 V | — |
| I/O Voltage Banks | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Betriebstemperatur | -40C to +100C (Industrial) | — |
| Gehäuse | 484-FBGA (F23) 23x23 mm, 1.0 mm pitch | 484-ball FBGA, 23 x 23 mm, 1.0 mm pitch |
| Montageart | Surface Mount | — |
| Process Technology | 60 nm low-power CMOS (TSMC) | 60 nm low power (TSMC) |
| Configuration Method | JTAG, Active Serial, Active Parallel | — |
| MSL-Level | 3 | — |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | — |
| Device Logic Elements | — | 75,408 |
| M9K Memory Blocks | — | 305 |
| Embedded 18x18 Multipliers | — | 244 |
| PLLs | — | 4 |
| Maximum User I/O | — | 292 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Operating Temperature Grade | — | Commercial (0C to 85C) |
| Configuration Modes | — | AS, AP, FPP, PS |
| JTAG Support | — | IEEE 1149.1 boundary-scan |
| Maximum Internal Frequency | — | 472.5 MHz |