EP4CE40F23C6 vs EP4CE40F23C8L Vergleich
Detaillierter Direktvergleich von EP4CE40F23C6 von Intel und EP4CE40F23C8L von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE40F23C6 | EP4CE40F23C8L |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $71,40 | $72,10 |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements | 39,600 | 39,600 |
| Embedded Memory | 1,161,216 bits (1134 Kbits) | 1,161,216 bits (1.16 Mbit) |
| Embedded Multipliers (18x18) | 116 | 116 |
| User I/O Pins | 328 | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | 20 |
| Configuration Schemes | AS, AP, FPP, JTAG | Active Serial, Passive Serial, JTAG |
| Process Technology | 60 nm low-power | 60 nm (TSMC low-power) |
| Core Voltage (VCCINT) | 1.2 V | — |
| Gehäuse | FBGA-484 (23 x 23 mm, 1.0 mm pitch) | 484-pin FBGA (F23), 1.0 mm ball pitch, 23x23 mm |
| Package Code | F23 | — |
| Speed Grade | C6 (commercial, mid-tier) | 8 (industrial low-power process, 8-stage logic) |
| Betriebstemperatur | 0C to +85C (commercial) | — |
| Montageart | Surface Mount (BGA) | — |
| RoHS-Status | Compliant | Compliant |
| General-Purpose PLLs | — | 4 |
| Maximum User I/O Pins | — | 328 |
| Core Voltage | — | 1.2 V |
| Operating Temperature Grade | — | Commercial (0C to +85C) [DATA_NEEDED: confirm 'C' suffix grade] |
| I/O Standards Supported | — | LVTTL, LVCMOS, LVDS, SSTL, HSTL, PCI, Differential LVDS |
| Embedded RAM Block Size | — | 9 Kbits (M9K blocks) |
| MSL-Level | — | 3 (per JEDEC J-STD-020) [DATA_NEEDED: confirm moisture sensitivity] |