EP4CE55F23C7N vs EP4CE40F23C7N Vergleich
Detaillierter Direktvergleich von EP4CE55F23C7N von Intel und EP4CE40F23C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE55F23C7N | EP4CE40F23C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $56,40 | $21,80 |
| Family | Cyclone IV E | — |
| Logic Elements | 55,856 | — |
| Configurable Logic Blocks (CLBs) | 3,491 | — |
| Embedded Memory | 2,396,160 bits | — |
| Maximum User I/O | 324 | 328 |
| Embedded 18x18 Multipliers | 66 | 116 |
| PLLs | 4 | 4 |
| Global Clock Networks | 16 | — |
| Maximum Operating Frequency | 472.5 MHz (C7 speed grade) | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| Process Technology | 60 nm low-power CMOS | 60 nm low-power CMOS |
| Gehäuse | 484-FBGA (F23) 23 x 23 mm, 1.0 mm pitch | 484-ball FineLine BGA (FBGA) |
| Betriebstemperatur | 0C to +85C (commercial, C7) | — |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS) | — |
| Montageart | Surface Mount (BGA) | — |
| RoHS-Status | Compliant | Compliant |
| Product Family | — | Cyclone IV E |
| Logic Elements (LE) | — | 39,600 |
| Embedded Memory Bits | — | 1,161,216 bits |
| Distributed RAM (Kbits) | — | 66.5 |
| Core Voltage | — | 1.2 V (typical) |
| Ball Pitch | — | 1.0 mm |
| Operating Temperature (Commercial) | — | 0C to +85C |
| Speed Grade | — | C7 |
| Configuration Methods | — | JTAG, Active Serial (AS), Passive Serial (PS) |