EP4CE55F29C7N vs EP4CE55F29C6N Vergleich
Detaillierter Direktvergleich von EP4CE55F29C7N von Intel und EP4CE55F29C6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE55F29C7N | EP4CE55F29C6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $138,00 | $49,95 |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements (LE) | 55,856 | — |
| Configurable Logic Blocks (CLBs) | 3,491 | — |
| Total RAM Bits | 2,396,160 | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| User I/O Count | 374 | — |
| Number of PLLs | [DATA_NEEDED: PLL count] | — |
| Gehäuse | 780-ball FBGA (F29) | 780-BGA (FBGA-780), 29 x 29 mm, 1.0 mm pitch |
| Package Dimensions | 29 mm x 29 mm | — |
| Ball Pitch | 1.0 mm | — |
| Betriebstemperatur | 0C to +85C (commercial) | — |
| Speed Grade | -7 (C7) | — |
| Core Voltage | 1.2 V nominal | 1.2 V |
| Versorgungsspannung | 1.2 V | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant (LEAD FREE) | Lead-free, RoHS compliant |
| Lead Free | Yes | — |
| Configuration Mode | JTAG, Active Serial, Passive Parallel | — |
| Logic Elements | — | 55,856 |
| Logic Array Blocks (LABs) | — | 3491 |
| Total Memory Bits | — | 239,6160 |
| Embedded 18x18 Multipliers | — | 374 |
| Maximum Operating Frequency | — | 472.5 MHz |
| PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Maximum User I/O Pins | — | [DATA_NEEDED: max user I/O count for F29 package] |
| I/O Voltage Support | — | 1.2 V to 3.3 V |
| Process Technology | — | 60 nm low-power |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| Configuration Methods | — | JTAG, Passive Serial (PS), Active Serial (AS) with EPCS |