EP4CE55F29C8N vs EP4CE55F29C6N Vergleich
Detaillierter Direktvergleich von EP4CE55F29C8N von Intel und EP4CE55F29C6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE55F29C8N | EP4CE55F29C6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $285,00 | $49,95 |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements (LE) | 55,856 | — |
| Embedded Memory | 2,340 Kbits | — |
| Embedded Multiplier Blocks (18x18) | 154 | — |
| Maximum User I/O Pins | 374 | [DATA_NEEDED: max user I/O count for F29 package] |
| Logic Array Blocks (LABs) | 3,491 | 3491 |
| Process Technology | 60 nm (TSMC low-power) | 60 nm low-power |
| Core Voltage | 1.2 V | 1.2 V |
| Gehäuse | 780-ball FBGA (F29) | 780-BGA (FBGA-780), 29 x 29 mm, 1.0 mm pitch |
| Montageart | Surface Mount | Surface Mount |
| Speed Grade | 8 (commercial) | — |
| Temperature Grade | Commercial (0 C to +85 C) | — |
| PLLs | 4 to 8 (per device) | 4 |
| Configuration Method | SRAM-based, volatile (requires external config device) | — |
| RoHS-Status | Compliant | Lead-free, RoHS compliant |
| Lead-Free / Halogen-Free | Yes (per part marking) | — |
| Logic Elements | — | 55,856 |
| Total Memory Bits | — | 239,6160 |
| Embedded 18x18 Multipliers | — | 374 |
| Maximum Operating Frequency | — | 472.5 MHz |
| Global Clock Networks | — | 20 |
| I/O Voltage Support | — | 1.2 V to 3.3 V |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| Configuration Methods | — | JTAG, Passive Serial (PS), Active Serial (AS) with EPCS |